S. L. Kriangsak

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Active since

2010

Affiliations

S. L. Kriangsak is an author at Institute of Microelectronics specializing in through-silicon vias, three-dimensional integration, and manufacturing processes.

Publications per year

2010–2010

Publications

3D chip stacking &#x00026; reliability using TSV-micro C4 solder interconnection

K. Y. Au, S. L. Kriangsak, X. R. Zhang et al. · 2010 · 23 citations

Engineering, Materials Engineering, Manufacturing Processes +14

3D interconnection process development and integration with low stress TSV

Tze‐Kwang Chua, Soon Wee Ho, H. Y. Li et al. · 2010 · 19 citations

Engineering, Manufacturing Engineering, Materials Science +16

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