Jaimal Williamson

Hygrothermal Aging Effects on Buried Molecular Structures at Epoxy Interfaces

John N. Myers, Chi Zhang, Kangwook Lee et al. · Langmuir · 2013 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +17

Plasma treatment effect on polymer buried interfacial structure and property

Nathan W. Ulrich, John S. Andre, Jaimal Williamson et al. · Physical Chemistry Chemical Physics · 2017 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique

Vishnu V. B. Reddy, I. Charles Ume, Jaimal Williamson et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 20 citations

Engineering, Electrical Engineering, Materials Science +16

Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis

John N. Myers, Xiaoxian Zhang, Yonghao Xiu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +16

The Degradation Mechanisms of Underfills Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Jeffrey C. Suhling et al. · 2020 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16