Concepedia

R. Caramto

RC

Statistics

Publications

2

Citations

56

H-Index

2

Active since

2011

Affiliations

Seoul National University(Current)

R. Caramto is an author at Seoul National University specializing in integrated circuit design, interconnect technology, and through-silicon vias.

Publications per year

2011–2016

2

Publications

2

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Tian Tian, Rao R. Morusupalli, Hyung‐Joon Shin et al. · Procedia Engineering · 2016 · 42 citations · Full text

, , +17

On the technology and ecosystem of 3D / TSV manufacturing

Klaus Hummler, Larry Smith, R. Caramto et al. · 2011 · 14 citations

, , +17

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