Rao R. Morusupalli

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Active since

2012

Affiliations

University of New Mexico(Current)

Lawrence Berkeley National Laboratory

Rao R. Morusupalli is an author at University of New Mexico specializing in interconnect technology, stress measurement, and three-dimensional integrated circuit interconnects.

Publications per year

2012–2016

Publications

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Tian Tian, Rao R. Morusupalli, Hyung‐Joon Shin et al. · Procedia Engineering · 2016 · 42 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond

Rao R. Morusupalli, Richard Rao, Tae-Kyu Lee et al. · 2012 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +17

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