Russ Dudley

Opportunities for natural infrastructure to improve urban water security in Latin America

Beth Tellman, Robert I. McDonald, Joshua Goldstein et al. · PLoS ONE · 2018 · 32 citations · Full text

Engineering, Hydrologic Hazard, Latin America +18

Backside Infrared Interferometric Patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) Etch Metrology

W. H. Teh, David Marx, David Grant et al. · IEEE Transactions on Semiconductor Manufacturing · 2010 · 19 citations

Engineering, Measurement, Backside Infrared Interferometric +22

Wafer Thickness Sensor (WTS) for etch depth measurement of TSV

David Marx, David Grant, Russ Dudley et al. · 2009 · 16 citations

Engineering, Measurement, Education +19

Wall Profiles Produced during Photoresist Masked Isotropic Etching

R. Brandes, Russ Dudley · Journal of The Electrochemical Society · 1973 · 14 citations

Reflection Removal, Pattern Transfer, Computational Imaging +2

Through-silicon-via process control in manufacturing for SiGe power amplifiers

J. Gambino, Trung Doan, J. Trapasso et al. · 2013 · 11 citations

Sige Power Amplifiers, Engineering, Volume Manufacturing +18