Jensen Tsai

Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Mike Tsai, Ryan Chiu, Dick Huang et al. · 2019 · 22 citations

Agriculture, Materials Engineering, Internet Of Things +16

Challenges of Ultra-Thin 5 Sides Molded WLCSP

Tom Tang, Albert Lan, Jason Wu et al. · 2016 · 21 citations

Engineering, Materials Engineering, Materials Science +14

Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable Devices

Humi Tang, Max Lu, Jensen Tsai et al. · 2017 · 12 citations

Engineering, Computer Engineering, Electrical Engineering +17

Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate

Tom Tang, Albert Lan, Jensen Tsai et al. · 2015 · 11 citations

Engineering, Electrical Engineering, Microfabrication +13

Innovative Packaging Solutions of 3D System in Package with Antenna Integration for IoT and 5G Application

Mike Tsai, Ryan Chiu, Eric He et al. · 2018 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17