4
Publications
94
Citations
4
H-Index
2018
Active since
Affiliations
Yaqiong Hou is an author at Beijing Technology and Business University specializing in mechanical engineering, electronic packaging, and microfabrication.
Top concepts
EngineeringHeat TransferThermodynamicsMicrofabricationThermal ModelingEnergy EfficiencyThermal HydraulicsThermal ManagementThermal EngineeringElectronic Packaging
Publications per year
2018–2024
4
4
Rows per page
1–4 of 4