Arne Heittmann

3D Chip Stack Technology Using Through-Chip Interconnects

P. Benkart, A. Kaiser, A. Munding et al. · IEEE Design & Test of Computers · 2005 · 91 citations

Engineering, Computer Architecture, True Multilayer Stacks +17

Stateful Three-Input Logic with Memristive Switches

Anne Siemon, R. Drabinski, Michael J. Schultis et al. · Scientific Reports · 2019 · 58 citations · Full text

Three-dimensional integration scheme with a thermal budget below 300 °C

P. Benkart, A. Munding, A. Kaiser et al. · Sensors and Actuators A Physical · 2007 · 22 citations

Numerical Analysis, 3D Ic Architecture, Engineering +11

Limits of writing multivalued resistances in passive nanoelectronic crossbars used in neuromorphic circuits

Arne Heittmann, Tobias G. Noll · 2012 · 21 citations

Engineering, Coded Pattern, Nanocomputing +16

Concept for diamond 3-D integrated UV sensor

A. Kaiser, Daniel Kueck, P. Benkart et al. · Diamond and Related Materials · 2006 · 17 citations

Diamond-like Carbon, Engineering, Sensor Design +2