Chungpin Liao

Fabrication of very high resistivity Si with low loss and cross talk

Yung‐Hsien Wu, Albert Chin, Kwang-Kuo Shih et al. · IEEE Electron Device Letters · 2000 · 49 citations

Engineering, Cross Talk, Integrated Circuits +16

RF loss and crosstalk on extremely high resistivity (10 k-1 MΩ-cm) Si fabricated by ion implantation

Yung‐Hsien Wu, Albert Chin, Kwang-Kuo Shih et al. · 2002 · 41 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +16

Isolation on Si wafers by MeV proton bombardment for RF integrated circuits

Lurng-Shehng Lee, Chungpin Liao, Chung-Len Lee et al. · IEEE Transactions on Electron Devices · 2001 · 40 citations

Electrical Engineering, Wafer Scale Processing, Engineering +15

Method of creating local semi-insulating regions on silicon wafers for device isolation and realization of high-Q inductors

Chungpin Liao, Tzuen‐Hsi Huang, Chwan-Ying Lee et al. · IEEE Electron Device Letters · 1998 · 34 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

A Parallel Derivation to the Maxwell-Garnett Formula for the Magnetic Permeability of Mixed Materials

Hsien‐Ming Chang, Chungpin Liao · World Journal of Condensed Matter Physics · 2011 · 27 citations · Full text

Magnetic Properties, Engineering, Negative-index Metamaterial +22