Daniel Shi

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Publications

Citations

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Active since

2007

Affiliations

Applied Science and Technology Research Institute(Current)

Daniel Shi is an author at Applied Science and Technology Research Institute specializing in chip packaging, packaging engineering, and advanced packaging.

Publications per year

2007–2010

Publications

Warpage reduction of package-on-package (PoP) module by material selection & process optimization

Peng Sun, V. C. K. Leung, Bin Xie et al. · 2008 · 28 citations

Engineering, Computer Engineering, Materials Engineering +14

Wafer-Level Film Selection for Stacked-Die Chip Scale Packages

Daniel Shi, Xuejun Fan · 2007 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +17

Development of a new Package-on-Package (PoP) structure for next-generation portable electronics

Peng Sun, V. C. K. Leung, Debbie Yang et al. · 2010 · 14 citations

Engineering, Computer Engineering, Packaging Design +10

Parametric study of electroplating-based via-filling process for TSV applications

K. Tsui, Siu-Kei Yau, V. C. K. Leung et al. · 2009 · 12 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

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