Concepedia

Lanxian Cheng

LC

10

Publications

298

Citations

10

H-Index

2015

Active since

Affiliations

South China University of Technology(Current)

South China Agricultural University

China Electronic Product Reliability and Environmental Test Institute

Ministry of Industry and Information Technology

Zhongkai University of Agriculture and Engineering

Lanxian Cheng is an author at South China University of Technology specializing in engineering, mechanical engineering, and materials engineering.

ORCID

Top concepts

Publications per year

2015–2019

10

Publications

10

Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints

Zhenlong Li, Lanxian Cheng, G.Y. Li et al. · Journal of Alloys and Compounds · 2016 · 63 citations

, , +9

Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading

Jiang Xia, Guoyuan Li, Bin Li et al. · Microelectronics Reliability · 2017 · 49 citations

, , +11

Comparison of fatigue life prediction methods for solder joints under random vibration loading

Jiang Xia, Lin Yang, Qunxing Liu et al. · Microelectronics Reliability · 2019 · 38 citations

, , +10

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

Zhenlong Li, G.Y. Li, Bin Li et al. · Journal of Alloys and Compounds · 2016 · 27 citations

, , +8

Reliability study of package-on-package stacking assembly under vibration loading

Jiang Xia, Lanxian Cheng, GuoYuan Li et al. · Microelectronics Reliability · 2017 · 25 citations

, , +6

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