Concepedia

Author

Lanxian Cheng

South China University of TechnologyORCID

Also Known As

L X Cheng, L. Cheng, L. X. Cheng, L.X. Cheng, LanXian Cheng, Lanxian Cheng, Longwei Cheng

27

Publications

340

Citations

10

H-Index

24

Concepts

All Affiliations

South China University of TechnologySouth China Agricultural UniversityChina Electronic Product Reliability and Environmental Test InstituteMinistry of Industry and Information TechnologyZhongkai University of Agriculture and Engineering
LC

About

Lanxian Cheng is an author at South China University of Technology specializing in engineering, mechanical engineering, and materials engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

10

10

298

2

Mechanical Engineering

7

7

184

3

Materials Engineering

6

6

166

4

Materials Science

6

6

166

5

Applied Physics

3

3

114

Lanxian Cheng

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10

Publications

298

Citations

10

H-Index

YearCitations

Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints

Zhenlong Li, Lanxian Cheng, G.Y. Li,

Journal of Alloys and Compounds

2016

63

Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading

Jiang Xia, Guoyuan Li, Bin Li,

Microelectronics Reliability

2017

49

Comparison of fatigue life prediction methods for solder joints under random vibration loading

Jiang Xia, Lin Yang, Qunxing Liu,

Microelectronics Reliability

2019

38

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

Zhenlong Li, G.Y. Li, Bin Li,

Journal of Alloys and Compounds

2016

27

Reliability study of package-on-package stacking assembly under vibration loading

Jiang Xia, Lanxian Cheng, GuoYuan Li,

Microelectronics Reliability

2017

25

Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

Lanxian Cheng, M.R. Liu, X.Q. Wang,

Materials Science and Engineering A

2016

24

Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

Lanxian Cheng, G. Y. Li, Zhenlong Li,

Journal of Materials Science Materials in Electronics

2015

23

Optimal Design for Vibration Reliability of Package-on-Package Assembly Using FEA and Taguchi Method

Jiang Xia, Guoyuan Li, Bin Li,

IEEE Transactions on Components Packaging and Manufacturing Technology

2016

20

Effect of nano-TiO2 addition on microstructural evolution of small solder joints

Zhenlong Li, G. Y. Li, Lanxian Cheng,

Journal of Materials Science Materials in Electronics

2016

15

Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate

Lanxian Cheng, G.Y. Li, X.Q. Wang,

Materials Science and Engineering A

2016

14

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