Publication | Closed Access
Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints
63
Citations
31
References
2016
Year
Materials ScienceMaterials EngineeringEngineeringCorrosionJoint SizeInterfacial Imc GrowthApplied PhysicsMetallurgical InteractionWeld Pool SolidificationElectronic PackagingMicrostructureSn-3.0ag-0.5cu-0.1tio2 Solder Joints
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