Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process - Concepedia

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Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

27

Citations

26

References

2016

Year

Zhenlong Li, G.Y. Li, Bin Li, Lanxian Cheng, Jiabao Huang, Yu Tang

Journal of Alloys and Compounds

Materials ScienceMaterials EngineeringImc GrowthReflow ProcessEngineeringMicrofabricationApplied PhysicsSize EffectElectronic PackagingMicroelectronicsMicrostructure

References

	Year	Citations

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