Concepedia

R.C. Dunne

RD

Statistics

Publications

5

Citations

102

H-Index

5

Active since

1997

Affiliations

Georgia Institute of Technology(Current)

DuPont (United States)

R.C. Dunne is an author at Georgia Institute of Technology specializing in mechanical engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringApplied PhysicsMicrofabricationMechanics Of MaterialsPlasticity3D PrintingPolymer Science

Publications per year

1997–2002

5

Publications

5

An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach

R.C. Dunne, Suresh K. Sitaraman · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 35 citations

Engineering, Mechanical Engineering, Advanced Manufacturing +20

Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux? 81) for high density interconnect applications

R.C. Dunne, Suresh K. Sitaraman, Shijian Luo et al. · Journal of Applied Polymer Science · 2000 · 20 citations

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

R.C. Dunne, Suresh K. Sitaraman · Journal of Electronic Packaging · 1997 · 19 citations

Engineering, Base Layer Thickness, Mechanical Engineering +23

Thermal and mechanical characterization of ViaLUX/sup TM/ 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications

R.C. Dunne, Srikrishna Sitaraman, Shijian Luo et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 15 citations

Cure Kinetics Model, Engineering, Mechanical Engineering +16

Process modeling for sequential build-up of multi-layered structures

R.C. Dunne, Srikrishna Sitaraman · 2002 · 13 citations

Engineering, Mechanical Engineering, Multilayered Substrate +18

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