Concepedia

Tyler Osborn

TO

Statistics

Publications

8

Citations

202

H-Index

8

Active since

2006

Affiliations

Georgia Institute of Technology(Current)

Tyler Osborn is an author at Georgia Institute of Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationSurface ScienceFlexible ElectronicsMechanical EngineeringChemistry

Publications per year

2006–2010

8

Publications

8

Low-Temperature Bonding of Copper Pillars for All-Copper Chip-to-Substrate Interconnections

Ate He, Tyler Osborn, Sue Ann Bidstrup Allen et al. · Electrochemical and Solid-State Letters · 2006 · 47 citations

Bonding Process, Engineering, Mechanical Engineering +19

All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization

Tyler Osborn, Ate He, Nefertari Galiba et al. · Journal of The Electrochemical Society · 2008 · 43 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections

Tyler Osborn, Nefertari Galiba, Paul A. Kohl · Journal of The Electrochemical Society · 2009 · 28 citations

Materials Science, Electrical Engineering, Chemical Engineering +15

High-Frequency Chip Connections

Todd Spencer, Tyler Osborn, Paul A. Kohl · Science · 2008 · 23 citations

Engineering, Device Integration, Computer Architecture +17

All-Copper Chip-to-Substrate Interconnects Part II. Modeling and Design

Ate He, Tyler Osborn, Sue Ann Bidstrup Allen et al. · Journal of The Electrochemical Society · 2008 · 20 citations

Materials Science, Electrical Engineering, Wafer Scale Processing +15

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