Tyler Osborn - Concepedia

Author

Tyler Osborn

Georgia Institute of Technology

Also Known As

Tyler Osborn

Publications

229

Citations

H-Index

Concepts

All Affiliations

Georgia Institute of Technology

About

Tyler Osborn is an author at Georgia Institute of Technology specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	202
2	Applied Physics	2	2	90
3	Chemical Engineering	2	2	40
4	Chemistry	2	2	31
5	Computer Engineering	2	2	43

Tyler Osborn

Publications

202

Citations

H-Index

Page 1

	Year	Citations
Low-Temperature Bonding of Copper Pillars for All-Copper Chip-to-Substrate Interconnections Ate He, Tyler Osborn, Sue Ann Bidstrup Allen, Electrochemical and Solid-State Letters Bonding ProcessEngineeringMechanical EngineeringInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2006	47
All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization Tyler Osborn, Ate He, Nefertari Galiba, Journal of The Electrochemical Society EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2008	43
Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections Tyler Osborn, Nefertari Galiba, Paul A. Kohl Journal of The Electrochemical Society Materials ScienceElectrical EngineeringChemical EngineeringEthylene GlycolEngineering	2009	28
High-Frequency Chip Connections Todd Spencer, Tyler Osborn, Paul A. Kohl Science EngineeringDevice IntegrationComputer ArchitectureInterconnection Network ArchitectureInterconnect (Integrated Circuits)	2008	23
All-Copper Chip-to-Substrate Interconnects Part II. Modeling and Design Ate He, Tyler Osborn, Sue Ann Bidstrup Allen, Journal of The Electrochemical Society Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)	2008	20
Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization Venmathy Rajarathinam, C. Hunter Lightsey, Tyler Osborn, Journal of Electronic Materials Materials ScienceConducting PolymerEngineeringPolymer SciencePhotosensitive Polynorbornene Dielectric	2009	19
Electroless Deposition and Characterization of PtxRu1−x Catalysts on Pt/C Nanoparticles for Methanol Oxidation William E. Mustain, Hyea Kim, V. Narayanan, Journal of Fuel Cell Science and Technology EngineeringElectroless DepositionElectrode-electrolyte InterfaceChemistryChemical Engineering	2010	12
All-copper chip-to-substrate interconnects: Bonding, testing, and design for electrical performance and thermo-mechanical reliability Tyler Osborn, Ate He, Hunter Lightsey, EngineeringMechanical EngineeringElectrical PerformanceAll-copper Chip-to-substrate InterconnectsInterconnect (Integrated Circuits)	2008	10

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