B. P. Liew

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Active since

2009

Affiliations

Agency for Science, Technology and Research(Current)

B. P. Liew is an author at Agency for Science, Technology and Research specializing in package reliability, flip-chip packaging, and packaging design.

Publications per year

2009–2010

Publications

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

Srinivasa Rao Vempati, Nandar Su, Chee Houe Khong et al. · 2009 · 42 citations

Engineering, Biomedical Engineering, Microelectromechanical Systems +14

Copper pillar bump structure optimization for flip chip packaging with Cu/Low-K stack

X.R. Zhang, Weijun Zhu, B. P. Liew et al. · 2010 · 19 citations

Engineering, Materials Engineering, Materials Science +17

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