Lang Bai

Study on Thickness Thinning Ratio of the Forming Parts in Single Point Incremental Forming Process

Mingshun Yang, Zimeng Yao, Yan Li et al. · Advances in Materials Science and Engineering · 2018 · 29 citations · Full text

Engineering, Mechanical Engineering, Advanced Manufacturing +16

A 2.0 V, 0.35 μm partially depleted SOI-CMOS technology

K. Mistry, G.J. Grula, J.W. Sleight et al. · 2002 · 21 citations

Low-power Electronics, M Sram Yield, Electrical Engineering +13

Influences of Vibration Parameters on Formability of 1060 Aluminum Sheet Processed by Ultrasonic Vibration-Assisted Single Point Incremental Forming

Mingshun Yang, Lang Bai, Yan Li et al. · Advances in Materials Science and Engineering · 2019 · 21 citations · Full text

Materials Science, Vibration Parameters, Enhanced Formability +15

Research on the Radial Accuracy of Ultrasonic Vibration-Assisted Single Point Incremental Forming Parts

Mingshun Yang, Lang Bai, Yunbo Lin et al. · International Journal of Aerospace Engineering · 2019 · 14 citations · Full text

Engineering, Mechanical Engineering, Residual Stress +16

Influences of Process Parameters and Vibration Parameters on the Forming Force in the Ultrasonic‐Assisted Incremental Forming Process

Lang Bai, Yan Li, Mingshun Yang et al. · Advances in Materials Science and Engineering · 2018 · 10 citations · Full text

Materials Science, Vibration Parameters, Engineering +11