Michio Uneda

Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials

Hideo Aida, Toshiro Doi, Hidetoshi Takeda et al. · Current Applied Physics · 2012 · 250 citations

Materials Engineering, Semiconductor Technology, Electrical Engineering +11

A study on combined vibration drilling by ultrasonic and low-frequency vibrations for hard and brittle materials

Ken-Ichi Ishikawa, Hitoshi Suwabe, Tetsuhiro Nishide et al. · Precision Engineering · 1998 · 82 citations

Materials Science, Stress Wave, Engineering +11

Highly efficient chemical mechanical polishing method for SiC substrates using enhanced slurry containing bubbles of ozone gas

Michio Uneda, Koji Fujii · Precision Engineering · 2020 · 31 citations

Materials Science, Chemical Engineering, Engineering +7

Fabrication Mechanism for Patterned Sapphire Substrates by Wet Etching

Natsuko Aota, Hideo Aida, Yutaka Kimura et al. · ECS Journal of Solid State Science and Technology · 2014 · 25 citations · Full text

Engineering, Electron-beam Lithography, Pattern Transfer +16

Relationships between Contact Image Analysis Results for Pad Surface Texture and Removal Rate in CMP

Michio Uneda, Yuki Maeda, Ken-Ichi Ishikawa et al. · Journal of The Electrochemical Society · 2011 · 23 citations · Full text

Materials Science, Image Rotation Prism, Pad Surface Texture +14