Jeroen van Borkulo

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Active since

2009

Affiliations

ASM International (Netherlands)(Current)

Jeroen van Borkulo is an author at ASM International (Netherlands) specializing in integrated circuit fabrication, die-to-wafer bonding, and wafer dicing.

Publications per year

2009–2021

Publications

Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Aakrati Jain, Kamal Sikka, Juan-Manuel Gomez et al. · 2021 · 13 citations

Engineering, Materials Engineering, Materials Science +17

Enabling Technology in Thin Wafer Dicing

Jeroen van Borkulo, Rogier Evertsen, Rene Hendriks · ECS Transactions · 2009 · 10 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Laser-Based Full Cut Dicing Evaluations for Thin Si Wafers

Jeroen van Borkulo, Richard van der Stam · 2018 · 10 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16

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