Concepedia

Maogong Jiang

MJ

8

Publications

116

Citations

8

H-Index

2017

Active since

Affiliations

Beihang University(Current)

China Aerospace Science and Technology Corporation

Aalborg University

Maogong Jiang is an author at Beihang University specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMaterial ScienceMicroelectronicsPower ElectronicsReliability EngineeringDiagnosisSinteringAssessment

Publications per year

2017–2021

8

Publications

8

A High-Efficiency IGBT Health Status Assessment Method Based on Data Driven

Zhongqing Zhang, Guicui Fu, Bo Wan et al. · IEEE Transactions on Electron Devices · 2020 · 20 citations

Engineering, Neural Network, Diagnosis +19

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

Jun Luo, Shukai Guan, Bo Wan et al. · IEEE Access · 2021 · 19 citations · Full text

Engineering, Mechanical Engineering, Defect Tolerance +18

Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation

Zhongqing Zhang, Guicui Fu, Bo Wan et al. · Microelectronics Reliability · 2021 · 15 citations

Materials Science, Sintering, Engineering +10

Failure analysis of solder layer in power transistor

Maogong Jiang, Guicui Fu, Bo Wan et al. · Soldering and Surface Mount Technology · 2017 · 14 citations

Reliability, Materials Science, Electrical Engineering +14

Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires

Maogong Jiang, Guicui Fu, Lorenzo Ceccarelli et al. · 2019 · 14 citations

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