Dewen Zhao

Chemical mechanical polishing: Theory and experiment

Dewen Zhao, Xinchun Lu · Friction · 2013 · 210 citations · Full text

Engineering, Mechanical Engineering, Theoretical Cmp Models +16

The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2022 · 46 citations

Materials Science, Wafer Scale Processing, Engineering +11

Prediction and measurement for grinding force in wafer self-rotational grinding

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2023 · 43 citations

Engineering, Mechanics, Material Machining +6

Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

Dewen Zhao, Tongqing Wang, Yongyong He et al. · IEEE Transactions on Semiconductor Manufacturing · 2013 · 39 citations

Engineering, Mechanical Engineering, Global Uniformity +19

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · Tribology International · 2023 · 37 citations

Wafer Scale Processing, Engineering, Ultra-precision Grinding Process +9