Hongfei Tao

The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2022 · 46 citations

Materials Science, Wafer Scale Processing, Engineering +11

Prediction and measurement for grinding force in wafer self-rotational grinding

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2023 · 43 citations

Engineering, Mechanics, Material Machining +6

Spiral tool path generation method in a NURBS parameter space for the ultra-precision diamond turning of freeform surfaces

Shuai He, Jianping Xuan, Wenhao Du et al. · Journal of Manufacturing Processes · 2020 · 37 citations

Geometric Modeling, Engineering, Nurbs Parameter Space +10

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · Tribology International · 2023 · 37 citations

Wafer Scale Processing, Engineering, Ultra-precision Grinding Process +9

Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · Tribology International · 2022 · 36 citations

Engineering, Microfabrication, Material Machining +7