Yuanhang Liu

The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2022 · 46 citations

Materials Science, Wafer Scale Processing, Engineering +11

Prediction and measurement for grinding force in wafer self-rotational grinding

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · International Journal of Mechanical Sciences · 2023 · 43 citations

Engineering, Mechanics, Material Machining +6

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · Tribology International · 2023 · 37 citations

Wafer Scale Processing, Engineering, Ultra-precision Grinding Process +9

Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process

Hongfei Tao, Yuanhang Liu, Dewen Zhao et al. · Tribology International · 2022 · 36 citations

Engineering, Microfabrication, Material Machining +7

Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon

Hongfei Tao, Qinyang Zeng, Yuanhang Liu et al. · Tribology International · 2023 · 30 citations

Materials Science, Materials Engineering, Engineering +12