Shuhei Kodama

Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications

Y. S. Kim, Shuhei Kodama, Y. Mizushima et al. · 2014 · 33 citations

Engineering, Emerging Memory Technology, Integrated Circuits +21

A robust wafer thinning down to 2.6-μm for bumpless interconnects and DRAM WOW applications

Y. S. Kim, Shuhei Kodama, Y. Mizushima et al. · 2015 · 19 citations

Engineering, Thin Film Process Technology, Interconnect (Integrated Circuits) +18

Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-on-Wafer (WOW) Integration

Y. S. Kim, Shuhei Kodama, Y. Mizushima et al. · 2018 · 18 citations

Engineering, Dry Process, Integrated Circuits +18

Control of short-pulsed laser induced periodic surface structures with machining - Picosecond laser micro/nanotexturing with ultraprecision cutting

Shuhei Kodama, Shinya Suzuki, Kazuya Hayashibe et al. · Precision Engineering · 2018 · 17 citations

Materials Science, Periodic Surface Structures, Advanced Laser Processing +14

Postbuckling behavior of circular cylindrical shells under compression

Noboru YAMAKI, Shuhei Kodama · International Journal of Non-Linear Mechanics · 1976 · 15 citations

Engineering, Mechanics, Shell Theory +8