Concepedia

H.J. Toh

HT

Statistics

Publications

3

Citations

55

H-Index

3

Active since

2006

Affiliations

Nanyang Technological University(Current)

H.J. Toh is an author at Nanyang Technological University specializing in device reliability, package reliability, and durability.

Publications per year

2006–2008

3

Publications

3

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

Desmond Y. R. Chong, J.H.L. Pang, Luhua Xu et al. · IEEE Transactions on Advanced Packaging · 2008 · 23 citations

, , +16

Performance Assessment on Board-level Drop Reliability for Chip Scale Packages (Fine-Pitch BGA)

Desmond Y. R. Chong, Luhua Xu, H.J. Toh et al. · 2006 · 18 citations

, , +16

Drop Reliability Performance Assessment for PCB Assemblies of Chip Scale Packages (CSP)

Desmond Y. R. Chong, H.J. Toh, Beng Kuan Lim et al. · 2006 · 14 citations

, , +17

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