Concepedia

Roland Schmidt

RS

Statistics

Publications

12

Citations

246

H-Index

11

Active since

2001

Affiliations

Infineon Technologies (Germany)(Current)

Siemens (Germany)

Fraunhofer Institute for Reliability and Microintegration

ABB (Switzerland)

Roland Schmidt is an author at Infineon Technologies (Germany) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingSolid MechanicsMechanical EngineeringMicrostructureMicroelectronicsElectrical EngineeringMechanics Of MaterialsMechanics

Publications per year

2001–2019

12

Publications

12

Non-Destructive Thermography Analysis of Impact Damage on Large-Scale CFRP Automotive Parts

Alexander Maier, Roland Schmidt, Beate Oswald-Tranta et al. · Materials · 2014 · 71 citations · Full text

On the mode II popcorn effect in thin packages

P. Alpern, R. Dudek, Roland Schmidt et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 22 citations

Package Crack Propagation, Engineering, Food Packaging +16

Young's modulus of moulding compounds measured with a resonance method

Roland Schmidt, V. Wicher, R. Tilgner · Polymer Testing · 2004 · 20 citations

Measurement of the Young's modulus of moulding compounds at elevated temperatures with a resonance method

Roland Schmidt, P. Alpern, R. Tilgner · Polymer Testing · 2004 · 19 citations

Materials Science, Elevated Temperatures, High Temperature Materials +11

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

G.J. Riedel, Roland Schmidt, C. Liu et al. · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) · 2012 · 18 citations

Engineering, Igbt Modules, Reliability Engineering +16

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