Marc Papenheim

A scalable anti-sticking layer process via controlled evaporation

Christian Steinberg, Khalid Dhima, Daniel Blenskens et al. · Microelectronic Engineering · 2014 · 32 citations

Materials Science, Engineering, Microfabrication +5

Thermal nanoimprint to improve the morphology of MAPbX3 (MA = methylammonium, X = I or Br)

André Mayer, Maximilian Buchmüller, Si Wang et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2017 · 24 citations

Optical Materials, Engineering, Material Innovation +23

Flexible composite stamp for thermal nanoimprint lithography based on OrmoStamp

Marc Papenheim, Christian Steinberg, Khalid Dhima et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2015 · 21 citations

Engineering, Mechanical Engineering, Flexible Stamps +17

Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Christian Steinberg, Maximilian Rumler, Manuel Runkel et al. · Microelectronic Engineering · 2017 · 18 citations

Materials Science, Industrial Design, Pattern Formation +13

Complex 3D structures via hybrid processing of SU-8

Christian Steinberg, Marc Papenheim, Si Wang et al. · Microelectronic Engineering · 2016 · 15 citations

Materials Science, Geometric Modeling, Engineering +10