E. Seppälä

Effect of stress triaxiality on void growth in dynamic fracture of metals: A molecular dynamics study

E. Seppälä, James Belak, Robert E. Rudd · Physical Review B · 2004 · 143 citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Silicon Vias, Oscillator Topologies +18

Onset of Void Coalescence during Dynamic Fracture of Ductile Metals

E. Seppälä, James Belak, Robert E. Rudd · Physical Review Letters · 2004 · 95 citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +22

Three-dimensional molecular dynamics simulations of void coalescence during dynamic fracture of ductile metals

E. Seppälä, James Belak, Robert E. Rudd · Physical Review B · 2005 · 73 citations · Full text

Engineering, Severe Plastic Deformation, Material Simulation +20

From Hot‐Injection Synthesis to Heating‐Up Synthesis of Cobalt Nanoparticles: Observation of Kinetically Controllable Nucleation

Jaakko V. I. Timonen, E. Seppälä, Olli Ikkala et al. · Angewandte Chemie International Edition · 2011 · 64 citations

Nanoparticles, Engineering, Metal Nanoparticles +19