D. Yost

A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 265 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +15

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Vyshnavi Suntharalingam, R. Berger, J.A. Burns et al. · 2005 · 122 citations

Room Temperature, Electrical Engineering, 3D Ic Architecture +14

High-Speed Schottky-Barrier pMOSFET With<tex>$f_T = 280 hbox GHz$</tex>

M. Fritze, C.L. Chen, S.D. Calawa et al. · IEEE Electron Device Letters · 2004 · 97 citations

Low-power Electronics, Electrical Engineering, Schottky Barrier Height +12

Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers

Brian F. Aull, J.A. Burns, C. Chen et al. · 2006 · 56 citations

Engineering, Geiger-mode Avalanche Photodiodes, Image Sensor +18

Solid-State Qubits: 3D Integration and Packaging

Danna Rosenberg, Steven Weber, David Conway et al. · IEEE Microwave Magazine · 2020 · 56 citations

Quantum Software, Engineering, Computational Chemistry +19