Benoit Thollin

Characterization of Nanosilver Dry Films for High-Temperature Applications

Rabih Khazaka, Benoit Thollin, L. Mendizabal et al. · IEEE Transactions on Device and Materials Reliability · 2015 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +17

Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test

Bassem Mouawad, Benoit Thollin, Cyril Buttay et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 23 citations · Full text

Engineering, Electrical Engineering, Manufacturing Engineering +16

From epitaxy to converters topologies what issues for 200 mm GaN/Si?

L. Di Cioccio, E. Morvan, Matthew Charles et al. · 2015 · 14 citations

Engineering, Electrical Engineering, Materials Science +16

Partial thermal impedance measurement for die interconnection characterization by a microsecond “pulsed heating curve technique”

Benoit Thollin, Laurent Dupont, Zoubir Khatir et al. · 2013 · 10 citations

Engineering, Electrical Engineering, Heat Transfer +16

Very low parasitic inductance double side cooling power modules based on ceramic substrates and GaN devices

Laurant Christine, Johan Delaine, Pierre Perichon et al. · 2020 · 10 citations

Engineering, Electrical Engineering, Microelectronics +16