Heinrich Koerner

Film Properties of CVD Titanium Nitride Deposited with Organometallic Precursors at Low Pressure Using Inert Gases, Ammonia, or Remote Activation

A. Intemann, Heinrich Koerner, F. Koch · Journal of The Electrochemical Society · 1993 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +14

Use of an in situ artificial substrate for biological accumulation and monitoring of aqueous trace metals a preliminary field investigation

S.L. Friant, Heinrich Koerner · Water Research · 1981 · 17 citations

Natural Sciences, Environmental Engineering, Environmental Sciences +17

Growth behavior and physical response of Al-Cu intermetallic compounds

R. Pelzer, S. Woehlert, Heinrich Koerner et al. · 2014 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide

Stefan E. Schulz, Heinrich Koerner, Christopher P. Murray et al. · Microelectronic Engineering · 2001 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +11

Model for the barrier diffusion into Cu interconnects at high temperatures

Oliver Aubel, M. Hommel, Heinrich Koerner · Microelectronic Engineering · 2005 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +16