Statistics
Publications
3
Citations
104
H-Index
3
Active since
1998
Toh Kok Chuan is an author at Nanyang Technological University specializing in engineering, heat transfer, and semiconductor devices.
Publications per year
1998–2013
3
3
3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections
Navas Khan, H.Y. Yu, Tan Siow Pin et al. · 2009 · 24 citations
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