N. Daix

The 16,000‐event 2003–2004 earthquake swarm in Ubaye (French Alps)

Liliane Jenatton, R. Guiguet, François Thouvenot et al. · Journal of Geophysical Research Atmospheres · 2007 · 78 citations · Full text

Engineering, Earthquake Hazards, Earthquake Scenario +17

Towards large size substrates for III-V co-integration made by direct wafer bonding on Si

N. Daix, Emanuele Uccelli, Lukas Czornomaz et al. · APL Materials · 2014 · 75 citations · Full text

Engineering, Optoelectronic Devices, Integrated Circuits +21

An integration path for gate-first UTB III-V-on-insulator MOSFETs with silicon, using direct wafer bonding and donor wafer recycling

Lukas Czornomaz, N. Daix, Daniele Caimi et al. · 2012 · 46 citations

Wide-bandgap Semiconductor, Integration Path, Engineering +20

Co-integration of InGaAs n- and SiGe p-MOSFETs into digital CMOS circuits using hybrid dual-channel ETXOI substrates

Lukas Czornomaz, N. Daix, Kangguo Cheng et al. · 2013 · 37 citations

Engineering, Device Integration, Digital Cmos Circuits +18

An InGaAs on Si platform for CMOS with 200 mm InGaAs-OI substrate, gate-first, replacement gate planar and FinFETs down to 120 nm contact pitch

Vladimir Djara, Veeresh Deshpande, Emanuele Uccelli et al. · 2015 · 32 citations

Engineering, Vlsi Design, Integrated Circuits +16