Concepedia

Author

Dong-Yurl Yu

Korea Institute of Industrial TechnologyORCID

Also Known As

Dong-Yurl Yu

32

Publications

187

Citations

9

H-Index

19

Concepts

All Affiliations

Korea Institute of Industrial TechnologyThe University of OsakaKorea UniversityGyeongguk National University
DY

About

Dong-Yurl Yu is an author at Korea Institute of Industrial Technology specializing in materials science, microstructure, and engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

4

4

79

2

Materials Engineering

3

3

64

3

Applied Physics

2

2

39

4

Electrical Engineering

2

2

26

5

Chemistry

1

1

28

Dong-Yurl Yu

×

9

Publications

143

Citations

9

H-Index

YearCitations

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko,

Microelectronics Reliability

2019

28

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko,

Journal of Alloys and Compounds

2017

25

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Gyu-Won Jeong, Dong-Yurl Yu, Junghwan Bang,

Materials

2021

17

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

Junghwan Bang, Dong-Yurl Yu, Young‐Ho Ko,

Journal of Welding and Joining

2016

15

Thermal reliability of Cu sintering joints for high-temperature die attach

Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim,

Microelectronics Reliability

2023

15

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module

Junhyuk Son, Minkyung Kim, Dong-Yurl Yu,

Journal of Welding and Joining

2017

11

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Junghwan Bang, Dong-Yurl Yu, Ming Yang,

Metals

2018

11

Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim,

Journal of Electronic Materials

2022

11

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Yong-Ho Ko, Kirak Son, Gahui Kim,

Journal of Materials Science Materials in Electronics

2018

10

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