Concepedia

Tobias Woitke

TW

Statistics

Publications

1

Citations

34

H-Index

1

Active since

2012

Affiliations

SUSS MicroTec (Germany)(Current)

Tobias Woitke is an author at SUSS MicroTec (Germany) specializing in chip packaging, microfabrication, and electronic materials.

Publications per year

2012–2012

1

Publications

1

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

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