C. Happ

Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

P. Zürcher, P. Alluri, Peir-Yung Chu et al. · 2002 · 63 citations

Engineering, Electrical Engineering, Materials Science +17

Application of on-chip MIM decoupling capacitor for 90nm SOI microprocessor

D. Roberts, Walter Johnstone, H. Sanchez et al. · 2006 · 17 citations

Engineering, Computer Engineering, Electrical Engineering +6

Tantalum nitride thin film resistors for integration into copper metallization based RF-CMOS and BiCMOS technology platforms

Rashaunda Henderson, P. Zürcher, A. Duvallet et al. · 2002 · 13 citations

Engineering, Electrical Engineering, Materials Science +17

Numerical Optimization of a Fully Cross-Coupled Rectifier Circuit for Wireless Passive Ultra Low Power Sensor Nodes

Dominik Mair, Manuel Ferdik, C. Happ et al. · Sensors · 2019 · 11 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17