Zhang Ron

Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy

Kaushik Mysore, Ganesh Subbarayan, Vikas Gupta et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +17

Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Jordan C. Roberts, Safina Hussain, M. Kaysar Rahim et al. · 2010 · 22 citations

Engineering, Materials Engineering, Materials Science +17

Computer-aided detection of lung cancer on chest radiographs: effect of machine CAD false-positive locations on radiologists' behavior

Matthew T. Freedman, Shih-Chung B. Lo, Teresa Osicka et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2002 · 19 citations

Medicine, Oncology, Radiology +15

Substantiation of numerical analysis methodology for CPU package with non-uniform heat dissipation and heat sink with simplified fin modeling

Vadim Gektin, Zhang Ron, Marlin Vogel et al. · 2004 · 13 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

<title>Computer-aided detection of lung cancer on chest radiographs: algorithm performance vs. radiologists' performance by size of cancer</title>

Matthew T. Freedman, Shih‐Chung B. Lo, Fleming Lure et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2001 · 12 citations

Medicine, Oncology, Radiology +15