Safina Hussain

Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Jordan C. Roberts, Safina Hussain, M. Kaysar Rahim et al. · 2010 · 22 citations

Engineering, Materials Engineering, Materials Science +17

Measurement of die stresses in microprocessor packaging due to thermal and power cycling

Jordan C. Roberts, Mohammad Motalab, Safina Hussain et al. · 2012 · 16 citations

Engineering, Computer Engineering, Materials Science +17

Application of stress sensing test chips to area array packaging

Jeffrey C. Suhling, R.C. Jaeger, Pradeep Lall et al. · 2009 · 15 citations

Engineering, Materials Engineering, Materials Science +17

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

R.C. Jaeger, Mohammad Motalab, Safina Hussain et al. · Journal of Electronic Packaging · 2014 · 12 citations

Engineering, Electrical Engineering, Materials Science +16

Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping

Jordan C. Roberts, Mohammad Motalab, Safina Hussain et al. · 2011 · 10 citations

Engineering, Computer Engineering, Electrical Engineering +17