Andreas Baschnagel

A High Current 3300V Module Employing Reverse Conducting IGBTs Setting a New Benchmark in Output Power Capability

Munaf Rahimo, U. Schlapbach, A. Kopta et al. · 2008 · 52 citations

Engineering, Electrical Engineering, Microelectronics +15

Next Generation IGBT and Package Technologies for High Voltage Applications

Arnost Kopta, Munaf Rahimo, Chiara Corvasce et al. · IEEE Transactions on Electron Devices · 2017 · 43 citations

Engineering, Electrical Engineering, Microelectronics +13

LinPak, a new low inductive phase-leg IGBT module with easy paralleling for high power density converter designs

Raffael Schnell, Samuel Hartmann, Dominik Truessel et al. · PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of · 2015 · 27 citations

Engineering, Electrical Engineering, Microelectronics +15

Realization of higher output power capability with the Bi-mode Insulated Gate Transistor (BIGT)

Munaf Rahimo, U. Schlapbach, R. Schnell et al. · European Conference on Power Electronics and Applications · 2009 · 16 citations

Engineering, Electrical Engineering, Microelectronics +16

BIGT control optimisation for overall loss reduction

Charalampos Papadopoulos, L. Storasta, Manuel Le Gallo et al. · 2013 · 10 citations

Engineering, Electrical Engineering, Microelectronics +11