Samuel Hartmann

Analysis of insulation failure modes in high power IGBT modules

J.-H. Fabian, Samuel Hartmann, A. Hamidi · Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005. · 2005 · 93 citations

Electrical Engineering, Reliability Engineering, Engineering +15

Next Generation IGBT and Package Technologies for High Voltage Applications

Arnost Kopta, Munaf Rahimo, Chiara Corvasce et al. · IEEE Transactions on Electron Devices · 2017 · 41 citations

Low-power Electronics, Electrical Engineering, Engineering +13

Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

Lydia Feller, Samuel Hartmann, Daniel Schneider · Microelectronics Reliability · 2008 · 40 citations

Electrical Engineering, Reliability Engineering, Engineering +8

Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts

Emre Özkol, Samuel Hartmann, Gontran Pâques · Microelectronics Reliability · 2014 · 31 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +12

A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies

Slavo Kicin, Felix Traub, Samuel Hartmann et al. · 2016 · 28 citations

Electrical Engineering, Engineering, High-current Power Module +12