Kamila Piotrowska

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Kamila Piotrowska, Rameez Ud Din, Flemming Bjerg Grumsen et al. · Journal of Electronic Materials · 2018 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +15

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics

Kamila Piotrowska, Magdalena Grzelak, Rajan Ambat · Journal of Electronic Materials · 2018 · 47 citations

Engineering, Materials Engineering, Materials Science +16

Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators

Kamila Piotrowska, Vadimas Verdingovas, Rajan Ambat · Journal of Materials Science Materials in Electronics · 2018 · 38 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +16

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Kamila Piotrowska, Morten Stendahl Jellesen, Rajan Ambat · Soldering and Surface Mount Technology · 2017 · 37 citations

Engineering, Materials Engineering, Materials Science +14

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Kamila Piotrowska, Rameez Ud Din, Morten Stendahl Jellesen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17