Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

Transient Liquid Phase Bonding

W. D. MacDonald, Thomas W. Eagar · Annual Review of Materials Science · 1992 · 306 citations

Natural Sciences, Materials Engineering, Materials Science +10

Modelling of transient liquid phase bonding

Y. Zhou, William F. Gale, T. H. North · International Materials Reviews · 1995 · 221 citations

Engineering, Materials Engineering, Materials Science +12

Unsteady-state diffusion or heat-conduction with moving boundary

P.V. Danckwerts · Transactions of the Faraday Society · 1950 · 158 citations

Engineering, Mechanical Engineering, Physics +14

Modeling of base metal dissolution behavior during transient liquid-phase brazing

Hiroshi Nakagawa, C. H. Lee, T. H. North · Metallurgical Transactions A · 1991 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +7