Modelling of transient liquid phase bonding

Abstract

Modelling of transient liquid phase (TLP) bonding is reviewed. The outputs produced during analytical and numerical modelling are discussed in detail and compared with actual experimental results produced when joining simple binary alloy systems. The effects of increased diffusivity at base material grain boundaries, of grain boundary motion, and of grain boundary grooving, on isothermal solidification during TLP bonding are described. There is a critical need for detailed research in which modelling output is closely related to direct microstructural observations during bonding of complex alloy systems.