Modeling of base metal dissolution behavior during transient liquid-phase brazing

Constitution of Binary Alloys

Max Hansen, K. Anderko, H. W. Salzberg · Journal of The Electrochemical Society · 1958 · 14.8K citations

Natural Sciences, Chemistry, Materials Science +8

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

Engineering, Materials Engineering, Materials Science +13

Mathematical analysis of segregations in continuously-cast slabs.

Tooru Matsumiya, Hiroyuki Kajioka, Shozo Mizoguchi et al. · Transactions of the Iron and Steel Institute of Japan · 1984 · 142 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Study on transient liquid insert metal diffusion bonding of Ni base superalloys. (Part 1). Dissolution phenomenon of base metal into liquid insert metal.

Yoshikuni Nakao, Kazutoshi Nishimoto, Kenji Shinozaki et al. · QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY · 1988 · 13 citations · Full text

Engineering, Materials Engineering, Materials Science +16