Atomic structure of Al/Al interface formed by surface activated bonding

Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

Tadatomo Suga, Yoshihiro Takahashi, Hideki Takagi et al. · Acta Metallurgica et Materialia · 1992 · 225 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of the surface treatment on the room-temperature bonding of Al to Si and SiO2

N. Hosoda, Yoshitaka Kyogoku, Tadatomo Suga · Journal of Materials Science · 1998 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +14

Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method

T. Akatsu, Gen Sasaki, N. Hosoda et al. · Journal of materials research/Pratt's guide to venture capital sources · 1997 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +12

A high-resolution electron microscopy study of secondary dislocations in Σ = 3, [ī10]—(ī1) grain boundaries of aluminium

M. Shamzuzzoha, P. A. Deymier, David J. Smith · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1991 · 16 citations

Natural Sciences, Materials Science, Physics +14

Investigations on the Interface Microstructure of Stainless Steel/Aluminum Joints Created by the Surface Activated Bonding Method

Yang Liu, N. Hosoda, Tadatomo Suga · Interface Science · 1997 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +11