The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn–6.5Zn–xCu Pb-free solders

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

A.A. El-Daly, A.E. Hammad · Materials & Design (1980-2015) · 2012 · 136 citations

Natural Sciences, Materials Engineering, Materials Science +13

Development of Sn–Zn lead-free solders bearing alloying elements

Liang Zhang, Songbai Xue, Lili Gao et al. · Journal of Materials Science Materials in Electronics · 2009 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +10

Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array

Leonardo R. Garcia, Wislei R. Osório, Leandro C. Peixoto et al. · Materials Characterization · 2010 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +14

Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

A.A. El-Daly, Y. Swilem, M.H. Makled et al. · Journal of Alloys and Compounds · 2009 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

A.A. El-Daly, W. M. Desoky, T.A. Elmosalami et al. · Materials & Design (1980-2015) · 2014 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +16