Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper

Ultrahigh Strength and High Electrical Conductivity in Copper

Lei Lu, Y.F. Shen, Xianhua Chen et al. · Science · 2004 · 3.3K citations

Natural Sciences, Materials Engineering, Materials Science +17

Revealing the Maximum Strength in Nanotwinned Copper

Lei Lu, Xiaofu Chen, Xiaoxu Huang et al. · Science · 2009 · 2.1K citations

Natural Sciences, Materials Engineering, Materials Science +17

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang‐Yao Hsiao, Chien-Min Liu, Han-wen Lin et al. · Science · 2012 · 385 citations

Natural Sciences, Materials Engineering, Materials Science +13

Predicting trends in rate parameters for self-diffusion on FCC metal surfaces

Paras M. Agrawal, Betsy M. Rice, Donald L. Thompson · Surface Science · 2002 · 347 citations

Natural Sciences, Materials Engineering, Materials Science +14

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Han-wen Lin, Yi-Sa Huang et al. · Scientific Reports · 2015 · 248 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17