Materials Science in Semiconductor Processing · 2024 · 20 citations · 25 references
EngineeringMaterials EngineeringMaterials SciencePhotonicsSemiconductor DevicesSemiconductor MaterialsLaser Material ProcessingLaser PhysicsLaser Surface ProcessingSemiconductor Device MaterialsSemiconductor PhysicsUltrafast OpticsSilicon CarbideSilicon Carbide (Sic) MaterialsUltrafast Laser Material ProcessingUltrafast Laser MicromachiningWafer Dicing
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John H. Marburger · Progress in Quantum Electronics · 1975 · 1K citations
4H-SiC wafer slicing by using femtosecond laser double-pulses
Eunho Kim, Yasuhiko Shimotsuma, Masaaki Sakakura et al. · Optical Materials Express · 2017 · 103 citations · Full text