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Design of ultra-microporous COF for effectively enhancing the dielectric and fire resistance of bismaleimide based electronic packaging material

Materials ScienceChemical EngineeringMiniaturizationEngineeringNanoporous MaterialMicrofabricationPrinted ElectronicsFire ResistanceMaterial InnovationUltra-microporous CofElectronic PackagingElectronic Packaging MaterialElectrical Insulation