Publication | Closed Access
Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
307
Citations
131
References
2021
Year
Materials ScienceElectrical EngineeringHigh Thermal ConductivityEngineeringLow Dielectric PropertiesPolymer SciencePolymer CompositesPolymer NanocompositesElectronic PackagingThermal ConductivityThermal Property
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